The network-enabled ConnectCore Wi-i.MX51 is a highly integrated and future-proof system-on-module (SoM) solution based on the Freescale i.MX51 application processor with a high performance 600/800 MHz ARM Cortex-A8 core, powerful multimedia capabilities and a complete set of peripherals. It is the ideal choice for a broad range of target markets/applications including medical, digital signage, security/surveillance, access control, retail, industrial/building automation, transportation, traffic control, utilities/energy and more.
Modules in the ConnectCore i.MX family feature the design, development and administrative advantages offered by Device Cloud by Etherios™. This secure, highly-scalable platform seamlessly ties enterprise applications and remote devices together.
The ConnectCore Wi-i.MX51 combines industry-leading performance, low power consumption and industrial operating temperature. Design integration is easy with key features like on-chip multimedia support, including multi-format 720P/30 fps video hardware decoding and 2D/3D graphics acceleration, dual-display interface, hardware encryption engine, 802.11abgn Wi-Fi interface, dual 10/100 Ethernet option and a comprehensive set of peripherals.
Modules in the ConnectCore i.MX embedded system-on-module family feature the design, development and administrative advantages offered by Device Cloud. This robust cloud platform makes it easy to configure and manage deployments and integrate devices with virtually any application. Device manufacturers can build secure, highly scalable and cost-effective solutions that seamlessly tie assets to applications, regardless of location.
Complete and cost-efficient Digi JumpStart Kits for Microsoft Windows Embedded CE 6.0 R3, Microsoft Windows Embedded Compact 7 (coming soon), Timesys Linux and Digi Embedded Linux allow immediate and professional embedded product development with dramatically reduced design risk and time-to-market.
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ConnectCore for i.MX51 JumpStart Kit for Windows Embedded CE 6.0R3 and Windows Embedded Compact 7, 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen
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CC-WMX51-CE |
CC-WMX51-CE |
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 ConnectCore for i.MX51 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen
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CC-WMX51-LX |
CC-WMX51-LX |
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ConnectCore for i.MX51 Development Kit for Timesys LinuxLink, 7" WVGA LCD panel with touchscreen
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CC-WMX51-LL |
CC-WMX51-LL |
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| Digi JumpStart Kits | North America: | International: | |
| ConnectCore for i.MX51 JumpStart Kit for Windows Embedded CE 6.0R3 and Windows Embedded Compact 7, 180-day evaluation version of Microsoft Visual Studio/Platform Builder, 7" WVGA LCD panel w/touchscreen View details |
CC-WMX51-CE |
CC-WMX51-CE |
Contact Us |
| ConnectCore for i.MX51 JumpStart Kit for Digi Embedded Linux, installation and setup support package, 7" WVGA LCD panel w/touchscreen View details |
CC-WMX51-LX |
CC-WMX51-LX |
Contact Us |
| ConnectCore for i.MX51 Development Kit for Timesys LinuxLink, 7" WVGA LCD panel with touchscreen View details |
CC-WMX51-LL |
CC-WMX51-LL |
Contact Us |
| Specifications | ConnectCore® i.MX51 | ConnectCore® Wi-i.MX51 |
| Processor | ||
| Processor Model | Freescale® i.MX51 | |
| Speed Grades | 600/800 MHz | |
| Core Type | ARM® Cortex™-A8 | |
| Cache Memory | 32 k L1 I-Cache, 32k L1 D-Cache, 256k L2-Cache (unified) | |
| Internal RAM | 128 KB (secure/non-secure) | |
| Vector Floating Point | • | |
| NEON Media Acceleration | • | |
| Memory | ||
| Flash | Up to 8 GB NAND flash | |
| RAM | Up to 512 MB DDR2 | |
| Debug | ||
| Secure JTAG | • | |
| ETM/ETB | • | |
| Power Management | ||
| Power Modes | Run, Wait, Stop, Low-power screen refresh | |
| Wake-up Events | GPIO, keypad, RTC (day/time of day), SD card/USB cable insertion, battery/charger attach | |
| Dynamic Voltage and Frequency Scaling | • | |
| Backlight Drivers | 3 | |
| Battery Management | • | |
| Real Time Clock | ||
| Battery Backup | • | |
| Security | ||
| Hardware encryption/decryption | AES, DES/3DES, RC4, C2 RSA, ECC MD5, SHA-1/224/256 |
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| Random Number Generator | • | |
| Run Time Integrity Checker | • | |
| Secure RAM (internal) | • | |
| Fuse Box (e-Fuses) | 64 Bits (application-specific use) | |
| Physical Tamper Detectors | • | |
| Timers | ||
| General Purpose Timer | 32-bit up-counter with clock source selection 2 input capture channels 3 output compare channels, forced compare |
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| Enhanced Periodic Interrupt Timer | 32-bit down-counter with clock source selection Set-and-forget/free-running modes Precision interrupt generation |
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| Watchdog | • | |
| Connectivity | ||
| UART | Up to 3 channels with bit rates up to 4 MHz, IrDA 1.0 support | |
| IrDA Infrared | Medium InfraRed (0.576/1.152 Mbps), Fast InfraRed (4 Mbps) | |
| CSPI | Master and slave mode Bit rate up to 25 Mbps (master) |
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| eCSPI | Up to 2 eCSPI channels, master and slave mode Bit rates up to 66.5 Mbps (master) |
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| I2C | Up to 3 channels, master/slave (7-/10-bit addressing) All: Standard (100 kbps) and fast (400 kbps) mode |
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| SD/SDIO/MMC | Up to 4 ports, 1-/4-/8-bit modes MMC: Up to 416 Mbps (8-bit mode), SD/SDIO: Up to 200 Mbps (4-bit mode) |
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| P-ATA | Up to 66 MB/s data rate PIO mode (0,1,2,3,4), multi-word DMA mode (0,1,2), Ultra DMA mode (0,1,2,3,4,5) |
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| USB 2.0 High-Speed | Up to 3 USB 2.0 High-Speed Host ports (transceiver-less) Up to 1 USB 2.0 OTG port with PHY |
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| 1-Wire | • | |
| ISO 7816 (SIM/Smart Card) | • | |
| Keypad | 8x8 keypad matrix | |
| PWM | 2 | |
| ADC (10-bit) | Up to 4 channels | |
| GPIO | Up to 128 GPIOs | |
| External Memory Bus | 16-bit data/28-bit address in non-multiplexed address/data mode 16-bit or 32-bit data/28-bit address in multiplexed address/data mode |
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| Multimedia | ||
| Camera | 2 camera ports Bayer RGB, Full RGB, YUV 4:4:4, YUV 4:2:2, Gray scale, Generic data Parallel interface (up to 522 Mbps) or fast serial interface (up to 1.44 Gbps) Fast serial: Up to 6M pixels @ 15 fps (Bayer), Parallel: Up to 8M pixels @ 15 fps (Bayer) Window-of-interest selection, frame rate reduction, color depth reduction |
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| Display | Primary and secondary display support / TV out (SD/HD) Up to 24-bit color depth, software contrast control Up to XGA (1024x768) @ 100 fps/720p (1280x720) @ 60 fps/1080i (1920x1080) @ 30 fps 3-/4-/5-wire serial interface, parallel, parallel bidirectional, DSI (4 lanes/4 channels) |
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| Image Processing Unit | Image enhancements, video/graphics combining, resizing, rotation/inversion, color conversion/correction | |
| Video Processing Unit | MPEG-4, H.263, H.264, MPEG-2, VC-1, DivX, RV10, MJPEG | |
| GPU (2D/3D) | 27 million triangles/sec, 166 million pixels/sec raw OpenVG 1.0, OpenGL ES Common Profile v1.0/v1.1/Direct3D Mobile, OpenGL ES Profile v2.0 |
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| Touchscreen Interface (4-wire) | • | |
| SPDIF (Tx) | • | |
| I2S/AC97/SSI | Up to 3 channels | |
| Ethernettd> | ||
| Physical Layer | 10/100Base-T | |
| Data Rates | 10/100 Mbps, auto-sensing | |
| Duplex Mode | Full or half duplex, auto-sensing | |
| Power over Ethernet (802.3af) | ||
| Power Over Ethernet | Development board ready for 802.3af PoE application kit (sold separately) | |
| Accelerometer | ||
| Three-Axis Accelerometer | ±2g/±4g/±8g Three-Axis Low-g Freescale MA7455L |
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| Wireless LAN | ||
| Standard | N/A | 802.11a/b/g/n |
| Antenna Connectors | N/A | 2 x U.FL |
| Dual Diversity | N/A | • |
| Frequency Bands | N/A | 2.412 - 2.484 GHz |
| N/A | 4.900 - 5.850 GHz | |
| Data Rates | N/A | 802.11b: 1, 2, 5.5, 11 Mbps |
| N/A | 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps | |
| N/A | 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps (MCS 0-7) | |
| Modulation | N/A | DBPSK, DQPSK, CCK, BPSK, QPSK, 16-QAM, 64-QAM |
| 802.11n Features | N/A | A-MPDU / A-MSDU, PSMP, MTBA, STBC, Greenfield Preamble, RIFS |
| Transmit Power (±2 dBm) | N/A | 802.11b: 17 dBm typical |
| N/A | 802.11g/n: 15 dBm typical | |
| N/A | 802.11a/n: 12 dBm typical | |
| Security | N/A | WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i |
| QoS | N/A | WMM, WMM-PS, 802.11e |
| Roaming Enhancements | N/A | 802.11k/r |
| Extended Range (802.11n) | N/A | • |
| Radio Certifcations (Pending) | N/A | USA, Canada, EU, Japan |
| Power Requirements (w/o Ethernet and Wi-Fi)+ | ||
| Typical1 | 700 mA @ 3.75 V | |
| Idle1 | 200 mA @ 3.75 V | |
| Module Population Options2 | ||
| Processor Speed Grade | • | |
| Memory (Flash/RAM) | • | |
| Network Interfaces | Single 10/100 Ethernet, dual 10/100 Ethernet, 802.11a/b/g/n WLAN | |
| Mechanical | ||
| Dimensions (L x W x H) | 82 mm x 50 mm x 6.5 mm | 82 mm x 50 mm x 8 mm |
| Module Connectors | 2 x 180-pin board-to-board connectors, 0.8 mm pitch (Mating connector FCI P/N 61083-184409LF or similar) |
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| Environmental | ||
| Operating Temperature | -40° C to +85° C (600 MHz) -20° C to +85° C (800 MHz) |
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| Storage Temperature | -50° C to +125° C | |
| Relative Humidity | 5% to 90% (non-condensing) | |
| Altitude | 12,000 feet (3,658 meters) | |
| Temperature/Climate Tests | IEC 60068-2-1 (Ab/Ad Cold: 16 h with -40° C), IEC 60068-2-2 (Bb/Bd: Dry heat: 16 h with +85° C), IEC 60068-2-78 (Damp heat steady state: 16h with +40° C and 93% rH) | |
| Shock/Vibration Tests | IEC 60068-2-6 Method Fc, IEC 60068-2-64 Method Fh, IEC 60068-2-27 Method Ea | |
| Regulatory Approvals (Pending) | ||
| FCC Part 15 Class B | • | |
| FCC Part 15 Sub C Section 15.247 | • | |
| IC RSS-210 Issue 5 Section 6.2.2(o) | • | |
| EN55022:2006 Class B | • | |
| ICES-003, Class B | • | |
| VCCI, Class B | • | |
| EN55024:1998 +A1:2001, A2:2003 | • | |
| EN61000-3-2:2006 | • | |
| EN61000-3-3:1995 +A1:2001, A2:2005 | • | |
| EN60950-1:2001 (UL60950-equivalent) |
• | |
| CSA C22.2, No. 60950 | • | |
ConnectCore® Wi-i.MX51 - Side
ConnectCore® Wi-i.MX51 - Bottom
